It's all powered by our 2-step advanced dry fog vapor technology.
Our proprietary mold removal and sterilization process uses a two-step system to create a safe, non-toxic 'cloud' that fills and penetrates every critical surface in your home, commercial, or industrial space. This 'dry cloud' is comprised of microscopic particles that kill everything from black mold fungi to bacteria and viruses on contact - without leaving any wet residue.
The Sterilant: InstaPURE
Step 1: First we apply the InstaPURE process using a Health Canada registered sterilant that denatures or safely kills all mold spores, fungi, bacteria, and viruses it comes in contact with. Containing tiny disinfectant particles that measure only a few microns, the InstaPURE process can permeate the hardest to reach places without damaging any surfaces. And although deadly to mold, it's safe enough to be FDA-approved for food contact.
The Protection: EverPURE
Step 2: EverPURE is the second application in our system providing lasting protection. While InstaPURE can disinfect virtually any home, office, or other building, what happens when new mold spores, bacteria and/or viruses enter the premises? EverPURE is the answer. EverPURE provides an EPA verified 90 days of protection. This anti-microbial leaves no residue but sits on your keyboard, doorknobs, and every other surface waiting for the next bacteria, mold spore, or virus looking for a place to land. When any pathogens try to land on the surface of your home, EverPURE destroys the cell on contact.
Why is this dry fog vapor system superior to rentable foggers or electrostatic spraying?
VaPure (Our Patented Technology)
Smaller droplets rebound from surfaces creating a vapor. The vapor, as well as the fumes, create an inescapable environment for mold, virus and bacteria
Wet Fog or Ozone (Other Technology)
The larger droplets burst and create wet surfaces, like rain. The larger particle size also creates gaps in molecular coverage. Surfaces treated are restricted to what is in the spray's path and below.